XMSIG directly invests, takes the lead or participates in corporate equity financing and mergers and acquisitions.
Relying on professional semiconductor fund management companies, the focus is on non-manufacturing projects in the IC industry.
Focus on supporting excellent chip design team
Industrial layout around product-oriented technology
Focusing on the layout of the advanced packaging industry chain, it will support the demand for downstream and carrier capacity after the expansion of China's large-scale production capacity.
Focus on meeting the needs of miniaturization, low power consumption and low cost. Terminal applications such as 5G, consumer, IOT, MEMS sensors, automotive, industrial and other markets driven by new business models.
Focus on the domestic industry chain of wafer manufacturing
Semiconductor non-mask lithography equipment and laser direct imaging equipment suppliers
Develop durable, reliable and secure storage solutions for embedded systems and enterprise data centers
Design and sales of high-performance SoC chips and application solutions for machine vision and speech recognition
Development, operation and sales of advanced MEMS RF filter chip technology for 4G/5G mobile communications
A global IC design company with target markets covering wireless audio, wireless video and the IoT.
SHIXIN committed to the design and sales of LED display large-screen driver chips, its products are more efficient and lower cost than similar products on the market.
A professional MEMS intelligent infrared sensing technology and service provider.
PAI is a 32-bit MCU expert dedicated to industrial-grade, high-quality MCUs for home health, the Internet of Things, smart manufacturing, and smart society.
Focusing on advancing the art of communication acoustic，and providing business customers total solutions to capture voice from near/mid/far field sources, under all perceivable working scenarios.
IPGoal is dedicated to mixed signal IP development and design services.
Companies that develop, manufacture and sell high-density flexible substrates (FPC) and related module products
3D Wafer Level System Packaging Platform for Featured Products Based on TSV/TGV Technology.
Panel level Fanout packaging for discrete components
Leading company that provides semiconductor and electronic industry with intelligent manufacture solution.